컨텐츠 바로가기 영역
주메뉴로 바로가기
본문으로 바로가기
A better IT world for all,
Center for Integrated Smart Sensors is making it with creative SMART IT convergences system technologies, we can make a better
where everyone's dreams come true.
About CISS Research Team

Research Team

Organization Board Auditor Director Research Team Administrative Team Technology Commercialization Team Evaluation Committee

1-3-3 Project Director

이미지
Hyeon-Min Bae

Project : Low power, high speed chip-to-chip interface using dielectric waveguide

  • Purpose

    · To develop a low-power, high-speed chip-to-chip interface platform using dielectric waveguide. · To resolve the issues of established technology; skin loss of metal interconnect and cost-inefficiency of optical interconnect. · To develop wideband, low-loss, cost-efficient dielectric waveguide and low-power CMOS 60GHz transceiver.

  • Contents

    · A low-power, high-speed chip-to-chip interface platform using dielectric waveguide. - Find out the optimized the structure and the dimension of dielectric waveguide and the type of dielectric material and realize it. - Design microstrip circuits to maximize the power transfer to dielectric waveguide. - Design mm-Wave high frequency package model. - Design low-power CMOS 60GHz transceiver.

  • Expected Contribution

    · A solely realizable cost-efficient and low-power solution for 100GE chip-to-chip interface and next generation of 400GE market. · A number of target applications: Data center, Memory link, Thunderbolt/USB, etc.

List